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What Are CoWoS-S, CoWoS-R, and CoWoS-L?
TSMC’s CoWoS (Chip on Wafer on Substrate) packaging technology is designed to address the high computational power requirements of AI chips by utilizing 2.5D/3D packaging to enhance efficiency. TSMC’s 2.5D CoWoS can be categorized into CoWoS-S, CoWoS-R, and CoWoS-L, with…
